JPH0322917Y2 - - Google Patents

Info

Publication number
JPH0322917Y2
JPH0322917Y2 JP1984108343U JP10834384U JPH0322917Y2 JP H0322917 Y2 JPH0322917 Y2 JP H0322917Y2 JP 1984108343 U JP1984108343 U JP 1984108343U JP 10834384 U JP10834384 U JP 10834384U JP H0322917 Y2 JPH0322917 Y2 JP H0322917Y2
Authority
JP
Japan
Prior art keywords
hybrid integrated
integrated circuit
bridge
semiconductor element
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984108343U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6122352U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984108343U priority Critical patent/JPS6122352U/ja
Publication of JPS6122352U publication Critical patent/JPS6122352U/ja
Application granted granted Critical
Publication of JPH0322917Y2 publication Critical patent/JPH0322917Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984108343U 1984-07-16 1984-07-16 混成集積回路装置 Granted JPS6122352U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984108343U JPS6122352U (ja) 1984-07-16 1984-07-16 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984108343U JPS6122352U (ja) 1984-07-16 1984-07-16 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS6122352U JPS6122352U (ja) 1986-02-08
JPH0322917Y2 true JPH0322917Y2 (en]) 1991-05-20

Family

ID=30667539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984108343U Granted JPS6122352U (ja) 1984-07-16 1984-07-16 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS6122352U (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020929Y2 (ja) * 1980-10-06 1985-06-22 キヤノン株式会社 電気回路素子の封止枠構造
JPS57170542A (en) * 1981-04-14 1982-10-20 Seiko Keiyo Kogyo Kk Semiconductor device

Also Published As

Publication number Publication date
JPS6122352U (ja) 1986-02-08

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